| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor pressure sensor capable of preventing generation of defective products with high accuracy.SOLUTION: The semiconductor pressure sensor includes a mother board 14 where one surface of a semiconductor pressure sensor chip 11 having a diaphragm 13 is connected to one surface and a first pressure guide hole 15 is formed, a spacer 16 disposed around the semiconductor pressure sensor chip, a circuit pattern 17 disposed in one surface of the spacer, a bonding wire 18 for interconnecting the circuit pattern and the semiconductor pressure sensor chip, a bump 19 having its one end surface connected to the circuit pattern, an insulating plate 21 where a second pressure guide hole 22 having one surface connected to the other end surface of the bump and communicated with a space formed around the bump and a signal line 23 having one end connected to the bump and a signal extracted to the outside are provided, and a case 24 having one end side connected to the insulating plate and the other end side connected to the mother board and enclosing the semiconductor pressure sensor chip, the spacer, and the bump. |
