| 摘要 |
PROBLEM TO BE SOLVED: To improve reducibility in wiring inductance, simultaneousness in the operation of semiconductor switching elements, and the fillability and adaptability of resin to circuits, thereby improving reliability, productivity and cost performance in high power applications.SOLUTION: A resin sealed power semiconductor module comprises: a thermoplastic resin case 2 which includes an opening 2a at the bottom face thereof letting a wiring pattern 1c formation region of a wiring board 1 be exposed and which is left open at the upper end thereof; and a thermoplastic terminal holding resin 3 which is engaged for fixation with the inside of the resin case. A first crossover part 3a of the terminal holding resin holding first to fourth electrode lead-out terminals (collector C1, emitter E2, gate G3, and auxiliary emitter E4) is arranged so as to cross the center of the resin case to divide the inner space into halves, while a second crossover part and internal connection parts C1b and E2b supported thereby are respectively extended from the central part to the opposite sides of the first crossover part before being divided into halves, so that in each of the four divided spaces are arranged a wiring pattern and a semiconductor element which are then wire-bonded and encapsulated with thermosetting resin. |
