SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method and a semiconductor device, which can prevent cracks of a wafer in manufacturing processes.SOLUTION: A semiconductor device manufacturing method of a present embodiment comprises: a step (S11) of preparing a laminate having a structure in which two wafers are soldered and laminated via an impurity supply source layer, and the two wafers are welded via the impurity supply source layer; a step (S12) of performing a processing treatment on each principal surface of the two wafers composing the laminate; and a step (S13) of detaching the two wafers which have been subjected to the processing treatment.