发明名称 RESIN COMPOUND, RESIN COMPOSITION, AND RESIN-MOLDED PRODUCT
摘要 PROBLEM TO BE SOLVED: To provide a resin compound with excellent flexibility after molding.SOLUTION: The resin compound includes: an aggregate of an aliphatic polyester and/or an aliphatic polyamide; and an aromatic compound represented by formula (1) (X)-(CHOH), in which the content in the composition of the aromatic compound is 0.1 pts.mass to 5 pts.mass with respect to 100 pts.mass of the aliphatic polyester and/or the aliphatic polyamide. In formula (1), X is an n-valent group including one or more aromatic rings, and n is an integer of 2 to 10.
申请公布号 JP2013129710(A) 申请公布日期 2013.07.04
申请号 JP20110278761 申请日期 2011.12.20
申请人 FUJI XEROX CO LTD 发明人 YAO KENJI
分类号 C08L67/00;C08K5/05;C08L77/00 主分类号 C08L67/00
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