| 摘要 |
PROBLEM TO BE SOLVED: To provide a small and thin wiring board which enables via conductors to be directly connected with surface wiring in a structure where recessed parts are formed on an upper surface of a ceramic wiring board and achieves high connection reliability.SOLUTION: Groove like recessed parts 9, each of which encloses one end part of surface wiring 5 so as to partially form a double portion, are formed on an upper surface of a ceramic wiring board 1, and an insulation resin 2a, leading from the one end part of the surface wiring 5 to the recessed part 9, penetrates into each recessed part 9. The surface wiring 5 is formed on the upper surface of the ceramic wiring board 1 passing through a clearance in the double portion of the recessed part 9. Since the surface wiring 5 can be formed on the surface of the ceramic wiring board 1 where the recessed parts 9 are formed, the size and the thickness of the wiring board are reduced. An area around a connection part between multiple via conductors 4 and one end of the surface wiring 5 is fixed by the recessed part 9 which is filled with the insulation resin 2a and is less likely to deform. Therefore, the structure makes the disconnection of the connection part less likely to occur. |
