发明名称 INSPECTION DEVICE FOR SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an inspection device for a semiconductor device capable of changing an electronic circuit for inspection into one chip for miniaturization, making an output impedance of an inspection signal supply circuit have a predetermined value, and accurately inspecting the semiconductor device of an inspection object without having any damage.SOLUTION: An inspection device for a semiconductor device has one semiconductor chip in which an inspection signal supply circuit for supplying an inspection signal to a semiconductor device to be measured, and a comparison circuit for inspecting a state of the semiconductor device to be measured by comparing an output signal from the semiconductor device to be measured with a reference value are formed. In the semiconductor chip, an impedance adjustment circuit is arranged which is for adjusting an output impedance of the inspection signal supply circuit.
申请公布号 JP2013130427(A) 申请公布日期 2013.07.04
申请号 JP20110278792 申请日期 2011.12.20
申请人 TOKYO ELECTRON LTD 发明人 YOSHINO KEIJI
分类号 G01R31/28 主分类号 G01R31/28
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