发明名称 METHOD FOR FABRICATING AN ISOLATION STRUCTURE
摘要 A method of fabricating an isolation structure including forming a trench in a top surface of a substrate and partially filling the trench with a first oxide, wherein the first oxide is a pure oxide. Partially filling the trench includes forming a liner layer in the trench and forming the first oxide over the liner layer using silane and oxygen precursors at a pressure less than 10 milliTorr (mTorr) and a temperature ranging from about 500° C. to about 1000° C. The method further includes producing a solid reaction product in a top portion of the first oxide. The method further includes sublimating the solid reaction product by heating the substrate in a chamber at a temperature from 100° C. to 200° C. and removing the sublimated solid reaction product by flowing a carrier gas over the substrate. The method further includes filling the trench with a second oxide.
申请公布号 US2013171803(A1) 申请公布日期 2013.07.04
申请号 US201313775907 申请日期 2013.02.25
申请人 LEE TZE-LIANG;JENG PEI-REN;FU CHU-YUN;CHERN CHYI SHYUAN;HUANG JUI-HEI;PENG CHIH-TANG;LIEN HAO-MING;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 LEE TZE-LIANG;JENG PEI-REN;FU CHU-YUN;CHERN CHYI SHYUAN;HUANG JUI-HEI;PENG CHIH-TANG;LIEN HAO-MING
分类号 H01L21/762 主分类号 H01L21/762
代理机构 代理人
主权项
地址