Disclosed herein is a circuit board including: an insulating material; a build-up layer formed on one surface of the insulating material, and including at least one circuit layer and at least one insulating layer; and a metal layer formed on the other surface of the insulating material and electrically disconnected from the circuit layer.
申请公布号
US2013168143(A1)
申请公布日期
2013.07.04
申请号
US201213454680
申请日期
2012.04.24
申请人
PARK SEUNG WOOK;PARK MI JIN;ROMERO CHRISTIAN;KWEON YOUNG DO;SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人
PARK SEUNG WOOK;PARK MI JIN;ROMERO CHRISTIAN;KWEON YOUNG DO
