| 摘要 |
<p>This semiconductor device, which has electronic components provided in a cavity of a module having a cavity structure, can be prevented from being increased in size. In the device, the module having the cavity structure is provided with a plurality of components, for instance, an IC (3) and chip components (6a, 6b), on one surface facing a mother substrate (9), said one surface being on the cavity side. The mother substrate (9) is provided with the chip components (6c, 6d) on parts of one surface facing the module having the cavity structure, said parts not having the components provided on the module surface having the components provided thereon.</p> |
