| 摘要 |
<p>PURPOSE: A semiconductor device is provided to adopt a configuration capable of displaying the inherent performance of a micro electro mechanical system (MEMS) device enough, thereby preventing an increase in the number of unnecessary processing processes. CONSTITUTION: A semiconductor device (1) includes a driver integrated circuit (IC), an organic insulating layer (3), an inorganic insulating layer (4), a cavity sealing structure, and a conductive member (8). The organic insulating layer is arranged on the driver IC. The inorganic insulating layer is formed on the organic insulating layer to be thinner than the organic insulating layer. The cavity sealing structure is formed on the inorganic insulating layer and seals an MEMS element (5) inside while securing a space between the MEMS element and the cavity sealing structure. The conductive member is arranged on the outer side of the cavity sealing structure and filled in a through-hole (7) formed to be penetrated through organic and inorganic insulating layers, thereby electrically connecting the driver IC and the MEMS element. The cavity sealing structure and the conductive member are sealed by a solder resister (10).</p> |
