LASER DIRECT STRUCTURING ELECTROLESS PLATING METHOD WITH TWO-STEP PRE-TREATMENT PROCESS AND INTENNA THEREOF

摘要

PURPOSE: A laser direct structuring (LDS) electroless plating method and an intenna thereof are provided to remove a plating failure factor according to a laser machining and a plating failure factor possibly generated in an injection at a same time. CONSTITUTION: A laser direct structuring (LDS) electroless plating method with a two-step pre-treatment process comprises the following steps: a shape required according to a design, and a size of a desired product is injection molded by using a raw material including a plastic (S110); a metal particle existing in a domain in which a scratch etc. is generated is pre-processed in order not to be plated (S120); a circuit pattern having a shape required by a predetermined design is processed with a laser in a material (S130); a gas of a pattern or a dust generated in a laser machining step is removed (S140); a palladium catalyst is used as a catalyst (S150); a copper strike step and a copper plating step are performed (S160); and a process solution same as a first activation step is used, and a material is dipped in a solution for 2 -7 minutes in a state of maintaining a temperature of 20-30°C (S170). [Reference numerals] (AA) Start; (BB) End; (S110) Injection molding step; (S120) First pre-treatment step; (S130) Laser machining step; (S140) Second pre-treatment step; (S150) First activation step; (S160) Copper strike step and a copper plating step; (S170) Second activation step; (S180) Electroless nickel plating step; (S190) Post-treatment step