| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic component assembly that is diced with high accuracy without using an alignment mark, and to provide a method of manufacturing the same. <P>SOLUTION: In the electronic component assembly, a plurality of electronic components 3 provided on a mounting substrate 2 is covered with a sheet sealing material 4 formed of epoxy resin, phenol resin, elastomer, and an inorganic filler and is sealed by heat pressing. The sealing material 4 is raised in its thickness direction and a convexity having the height of 25 to 200 um is formed on the peripheral end of the electronic component 3. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
