| 摘要 |
PROBLEM TO BE SOLVED: To provide an on-vehicle semiconductor device that is made compact, lightweight and low-cost. SOLUTION: When a circuit board 400 and a positioning plate 800 of a motor driver 1000 are fabricated, it is preferred that they are formed of cores of the same material using a common board molding machine. Specifically, the circuit board and positioning plate are formed by punching the core materials by a press machine when they are sent to the board molding machine. When the circuit board and positioning plate have different outward shapes, dies of the press machine are changed to form suitable outward shapes. Thus, the common board molding machine is used for the circuit board 400 and positioning plate 800 and the need for a resin molding process for forming the positioning plate is thereby eliminated to lower the manufacturing cost for the board. COPYRIGHT: (C)2011,JPO&INPIT |
