发明名称
摘要 Embodiments herein present a structure, method, etc. for making high density MOSFET circuits with different height contact lines. The MOSFET circuits include a contact line, a first gate layer situated proximate the contact line, and at least one subsequent gate layer situated over the first gate layer. The contact line includes a height that is less than a combined height of the first gate layer and the subsequent gate layer(s). The MOSFET circuits further include gate spacers situated proximate the gate layers and a single contact line spacer situated proximate the contact line. The gate spacers are taller and thicker than the contact line spacer.
申请公布号 JP5225102(B2) 申请公布日期 2013.07.03
申请号 JP20080549683 申请日期 2007.01.09
申请人 发明人
分类号 H01L21/8234;H01L21/28;H01L21/336;H01L21/768;H01L21/8244;H01L23/522;H01L27/08;H01L27/088;H01L27/11;H01L29/78;H01L29/786 主分类号 H01L21/8234
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