| 摘要 |
The invention provides copper alloy, forged copper, an electronic component and a connector. The copper alloy contains 2.0-4.0 % of Ti by mass, 0-0.5% of one or more than two third elements selected from Mn, Fe, Mg, Co, Ni, Cr, V, Mo, Nb, Zr, Si, B and P by mass in total, and copper alloy containing copper and unavoidable impurities. The titanium concentration in the parent phase of the copper alloy for electronic components is observed through a scanning transmission electron microscopy. The amplitude Y (wt%) of the titanium concentration in the parent phase of a cross section parallel to the rolling direction of the copper alloy and the titanium concentration X (wt%) of the copper alloy for electronic components satisfy the relationship of 0.83 X - 0.65 < Y < 0.83X + 0.50. |
