| 摘要 |
A heat dissipation device with multiple heat conducting pipes is mounted on a heat-generating element disposed on a carrier. The heat dissipation device includes a heat dissipation base having at least one heat dissipation body, and a plurality of heat conducting pipes which are connected to the heat dissipation body and protrude outwards. The heat conducting pipes are used to dissipate the heat generated by the heat-generating element via heat conduction and natural convection with air, thus having a double heat dissipation effect. |
