| 摘要 |
PURPOSE: A photocurable resin composition is provided to have high curing density, thereby forming excellent adhesion and mechanical strength, and to form various patterns onto various substrates. CONSTITUTION: A photocurable resin composition includes 10-65 wt% of a urethane acrylate oligomer including a repeating unit represented by chemical formula 1 and 2; 20-85 wt% of a monomer with a double bond; 0.1-10 wt% of a photopolymerization initiator; and 3-10 wt% of a curing accelerator. In the chemical formulas, each of l, m, n is an integer from 0-30; and p and q is an integer from 0-50. The photocurable resin composition includes one or more additional additives selected from an antifoaming agent, moisturizing agent, dispersant, and rheology additives.
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