<p>A sheet of a material is disposed in a melt of the material. The sheet is formed using a cooling plate in one instance. An exciting coil and sensing coil are positioned downstream of the cooling plate. The exciting coil and sensing coil use eddy currents to determine a thickness of the solid sheet on top of the melt.</p>
申请公布号
EP2609235(A1)
申请公布日期
2013.07.03
申请号
EP20110746061
申请日期
2011.07.18
申请人
VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC.
发明人
ROSEN, GARY, J.;SINCLAIR, FRANK;SOSKOV, ALEXANDER;BUFF, JAMES, S.
