| 摘要 |
<p>PURPOSE: A method of molding resin is provided to prevent a wire from being cut even if a semiconductor element in a wire bonding type resin-molds and to improve the productivity. CONSTITUTION: A method of molding resin comprises the steps of: preparing an upper mold and a lower mold (110) where a cavity is formed to form a molded product and is separated to face the upper mold; loading the molded product on one surface of the upper mold; supplying first resin partially filling the cavity; clamping the upper mold and the lower mold; and supplying second resin in the cavity using a resin supply unit (170) formed in the thickness direction of the lower mold while being adjacent to the cavity.</p> |
