发明名称 LIGHT EMITTING DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
摘要 PURPOSE: A light emitting device and a method for manufacturing the same are provided to easily manufacture the light emitting device by forming a light emitting element on a first or a second conductive layer. CONSTITUTION: A first conductive layer (22) and a second conductive layer (23) are arranged on the upper surface of a metal body part. A trench part separates the first conductive layer from the second conductive layer. An insulating layer is formed between the metal body part and the first conductive layer. The insulating layer is formed between the metal body part and the second conductive layer. A light emitting element (10) is arranged on the first conductive layer or the second conductive layer.
申请公布号 KR20130073076(A) 申请公布日期 2013.07.03
申请号 KR20110140733 申请日期 2011.12.23
申请人 LUMENS CO., LTD.;WAVENICS, INC. 发明人 CHO, HYUN RYONG;KIM, KYOUNG MIN;YOO, SUNG HWAN
分类号 H01L33/48 主分类号 H01L33/48
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