IN-CONTAINING LEAD-FREE SOLDER FOR ON-VEHICLE ELECTRONIC CIRCUIT

摘要

A lead-free solder alloy which can be used for soldering of vehicle-mounted electronic circuits and which exhibits high reliability is provided. The alloy consists essentially of Ag: 2.8 - 4 mass %, In: 3-5.5 mass %, Cu: 0.5 - 1.1 mass %, if necessary Bi: 0.5 - 3 mass %, and a remainder of Sn. In is at least partially in solid solution in the Sn matrix.