| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a lead frame wherein a resin scarcely flows over grooves even when the resin leaked from a mold cavity is concentrated to a local area of the grooves upon a molding process. <P>SOLUTION: The lead frames 6 and 7 have an electrical connection region 12 to which a connection member is connected or on which an optical semiconductor device is mounted. Annular resin guiding grooves 14 and 15 surrounding the electrical connection region 12 are formed in one main surface of the lead frames 6 and 7, and each of the resin guiding groove 14 and 15 has an opening 17 opened in the one main surface of the lead frames 6 and 7 and has a V-shaped cross section. The width of each of the resin guiding grooves 14 and 15 becomes smaller as proceeding toward the deep recess ends 14a, 15a from the opening 17, and the deep recess ends 14a and 15a of the respective resin guiding grooves 14 and 15 are acute. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
