发明名称 HOT PLATE COOLING APPARATUS
摘要 PURPOSE: An apparatus for cooling high temperature materials is provided to accurately performing a cooling process with spraying air. CONSTITUTION: An apparatus for cooling high temperature materials comprises a device header (20), and a cooling medium supply tube (40). The device header is installed on a moving route of a high temperature material, and comprises a nozzle unit. The cooling medium supply tube is connected to the device header, and is selectively supplied with a coolant or air. The nozzle unit comprises a hose pipe or nozzle which sprays the coolant or air. The cooling medium supply tube comprises an air supply pipe and coolant supply pipes connected to each other. [Reference numerals] (AA) Coolant section; (BB) Air section
申请公布号 KR20130073413(A) 申请公布日期 2013.07.03
申请号 KR20110141243 申请日期 2011.12.23
申请人 POSCO 发明人 LEE, PIL JONG;SEONG, EON SIK;KANG, JONG HOON;KWON, HUI SEOP
分类号 B21B45/02 主分类号 B21B45/02
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