发明名称 |
HOT PLATE COOLING APPARATUS |
摘要 |
PURPOSE: An apparatus for cooling high temperature materials is provided to accurately performing a cooling process with spraying air. CONSTITUTION: An apparatus for cooling high temperature materials comprises a device header (20), and a cooling medium supply tube (40). The device header is installed on a moving route of a high temperature material, and comprises a nozzle unit. The cooling medium supply tube is connected to the device header, and is selectively supplied with a coolant or air. The nozzle unit comprises a hose pipe or nozzle which sprays the coolant or air. The cooling medium supply tube comprises an air supply pipe and coolant supply pipes connected to each other. [Reference numerals] (AA) Coolant section; (BB) Air section
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申请公布号 |
KR20130073413(A) |
申请公布日期 |
2013.07.03 |
申请号 |
KR20110141243 |
申请日期 |
2011.12.23 |
申请人 |
POSCO |
发明人 |
LEE, PIL JONG;SEONG, EON SIK;KANG, JONG HOON;KWON, HUI SEOP |
分类号 |
B21B45/02 |
主分类号 |
B21B45/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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