发明名称 MICROWAVE MODULE
摘要 <p>The present application relates to a microwave module comprising a printed circuit board, a first housing part, a second housing part, and a diplexer. It is specifically proposed that the first and second housing parts are adapted to act as a shielding cover, and that the diplexer and its filter are an integrated part in the module and are made out of the shielding cover and the printed circuit board.</p>
申请公布号 EP2609683(A1) 申请公布日期 2013.07.03
申请号 EP20110865615 申请日期 2011.05.17
申请人 HUAWEI TECHNOLOGIES CO., LTD. 发明人 WENNBERG, GORAN;HAMMAR, PETER;MADEBERG, BENGT;BERGSTEDT, LEIF
分类号 H04B1/03;H01P1/205;H01P1/213;H05K9/00 主分类号 H04B1/03
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