发明名称 |
MICROWAVE MODULE |
摘要 |
<p>The present application relates to a microwave module comprising a printed circuit board, a first housing part, a second housing part, and a diplexer. It is specifically proposed that the first and second housing parts are adapted to act as a shielding cover, and that the diplexer and its filter are an integrated part in the module and are made out of the shielding cover and the printed circuit board.</p> |
申请公布号 |
EP2609683(A1) |
申请公布日期 |
2013.07.03 |
申请号 |
EP20110865615 |
申请日期 |
2011.05.17 |
申请人 |
HUAWEI TECHNOLOGIES CO., LTD. |
发明人 |
WENNBERG, GORAN;HAMMAR, PETER;MADEBERG, BENGT;BERGSTEDT, LEIF |
分类号 |
H04B1/03;H01P1/205;H01P1/213;H05K9/00 |
主分类号 |
H04B1/03 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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