| 摘要 |
<p>A plurality of via-holes are formed in panel-shaped glass, and a plurality of via-holes are formed in two bases. Then, the panel-shaped glass is interposed between the two bases, positions of a plurality of the via-holes of the bases and a plurality of the via-holes of the panel-shaped glass are aligned, wires made of a conductive material are penetrated, and the wires between the two bases are stretched. Then, the panel-shaped glass is heated to a point higher than a softening point of the glass, the wires between the bases are buried by the glass, and the glass is cooled to form a glass ingot having the buried wires. Then, the ingot is sliced to form a glass substrate, the glass panel is polished to expose the wires on front and rear surfaces as the through electrodes.
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