发明名称 Large area ICP source for plasma application
摘要 <p>In an arrangement for coupling RF energy for inductively coupled plasma chamber, a RF coil (515) or radiator is embedded within a groove (530) made in the ceiling of the chamber and an insulating filler (535, 540) covers the coil within the groove. The ceiling may be made of two plates: an upper plate (522)made of conductive material and a bottom plate (524) made of dielectric material. The two plates are in physical contact. A magnetic shield (545) may be provided over the coil to control the spread of the magnetic field from the coil. Fluid channels (570, 575) may be made in the conductive plate to provide thermal control. Also, fluid conduits (560) may be provided to allow injecting gas into the pace between the metal and dielectric plates. </p>
申请公布号 EP2525388(A3) 申请公布日期 2013.07.03
申请号 EP20120168204 申请日期 2012.05.16
申请人 INTEVAC, INC. 发明人 CHO, YOUNG KYU;BLUCK, TERRY;JANAKIRAMAN, KARTHIK
分类号 H01J37/32 主分类号 H01J37/32
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