PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR

摘要

PURPOSE: A printed circuit board and a manufacturing method thereof are provided to avoid the etching of a base substrate, thereby increasing the surface area. CONSTITUTION: An insulating layer (120) is formed on one side of a base substrate. A metal layer (130) is formed on one side of the base substrate. A pressing process is performed in a part of the base substrate. A protrusion unit (114) is formed on one side of the base substrate by the process. The insulating layer and the metal layer on the protrusion part are removed. [Reference numerals] (AA) Laminating; (BB) Press; (CC) Polishing