摘要 |
A lamp device includes a heat sink, substrate, and fixing surface. The heat sink has a body with an opening, a plurality of fins for dissipating heat, and a plate coupled to the fins. The substrate is located under the fins and is coupled to a plurality of light emitting diodes. The fixing surface is coupled to the heat sink and also has an opening. Light from the light emitting diodes is emitted to the opening of the fixing surface, and a same axis passes through the openings of the body and fixing surface. |