发明名称 Solder apparatus
摘要 An apparatus for presoldering electrical components can include a die device having a punch member for punching a solder preform from a sheet of solder, and pressing the solder preform against an electrical component. A heating device can press against the electrical component on a opposite side from the die device for sandwiching the electrical component between the punch member and the heating member, for heating the electrical component and melting the solder preform thereon.
申请公布号 US8474681(B1) 申请公布日期 2013.07.02
申请号 US201213409347 申请日期 2012.03.01
申请人 PEREIRA JOHN;HENDRICK JOHN P.;COLE LAWRENCE RICHARD;ANTAYA TECHNOLOGIES CORP. 发明人 PEREIRA JOHN;HENDRICK JOHN P.;COLE LAWRENCE RICHARD
分类号 B23K1/00 主分类号 B23K1/00
代理机构 代理人
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