PROBE CARD AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A probe card and a manufacturing method thereof are provided to reduce manufacturing time and costs by omitting a process for planarizing a metal layer. CONSTITUTION: A bonding unit (40) includes at least one metal layer and a solder material layer. The metal layer is separated from one surface of a substrate (10). At least one probe pin is inserted into the groove part of the metal layer. The probe pin includes a bonding part, a body part (72), and a contact part. The body part is connected to one end of the contact part and supports the contact part.