发明名称 |
Ni plating of a BLM edge for Pb-free C4 undercut control |
摘要 |
A structure and a method of manufacturing a Pb-free Controlled Collapse Chip Connection (C4) with a Ball Limiting Metallurgy (BLM) structure for semiconductor chip packaging that reduce chip-level cracking during the Back End of Line (BEOL) processes of chip-join cool-down. An edge of the BLM structure that is subject to tensile stress during chip-join cool down is protected from undercut of a metal seed layer, caused by wet etch of the chip to remove metal layers from the chip's surface and solder reflow, by an electroplated barrier layer, which covers a corresponding edge of the metal seed layer.
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申请公布号 |
US8476762(B2) |
申请公布日期 |
2013.07.02 |
申请号 |
US201213463879 |
申请日期 |
2012.05.04 |
申请人 |
DAUBENSPECK TIMOTHY H.;GAMBINO JEFFREY P.;MUZZY CHRISTOPHER D.;SAUTER WOLFGANG;INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
DAUBENSPECK TIMOTHY H.;GAMBINO JEFFREY P.;MUZZY CHRISTOPHER D.;SAUTER WOLFGANG |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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