发明名称 Method for manufacturing nitride semiconductor crystal layer
摘要 According to one embodiment, a method is disclosed for manufacturing a nitride semiconductor crystal layer. The method can include forming the nitride semiconductor crystal layer having a first thickness on a silicon crystal layer. The silicon crystal layer is provided on a base body. The silicon crystal layer has a second thickness before the forming the nitride semiconductor crystal layer. The second thickness is thinner than the first thickness. The forming the nitride semiconductor crystal layer includes making at least a portion of the silicon crystal layer incorporated into the nitride semiconductor crystal layer to reduce a thickness of the silicon crystal layer from the second thickness.
申请公布号 US8476151(B2) 申请公布日期 2013.07.02
申请号 US201113037582 申请日期 2011.03.01
申请人 SUGIYAMA NAOHARU;SHIODA TOMONARI;NUNOUE SHINYA;KABUSHIKI KAISHA TOSHIBA 发明人 SUGIYAMA NAOHARU;SHIODA TOMONARI;NUNOUE SHINYA
分类号 H01L21/20 主分类号 H01L21/20
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