发明名称 MOLDING DEVICE
摘要 PURPOSE: A mold device is provided to reduce the number of processes by simultaneously processing the outer shape and cutting and to save a cost and the time according to the reduction of the process. CONSTITUTION: A mold device comprises an upper support stand (111), a plate (112), an upper mold (110), a die, a lower support stand (121). The plate is formed in a lower part of the upper support stand and includes an outer shape processing punch (114) and a cutting blade (113). The die includes a cutting blade groove which is formed in the position corresponding to the cutting blade and a punch groove which is formed in the position corresponding to the outer shape processing punch. The lower support stand is formed in a lower part of the die and supports the die.
申请公布号 KR20130072696(A) 申请公布日期 2013.07.02
申请号 KR20110140234 申请日期 2011.12.22
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 HAN, SANG HO;JO, GYU DAE
分类号 B26F1/40;H05K3/00 主分类号 B26F1/40
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