发明名称 |
Wirebonding method and apparatus |
摘要 |
A method and apparatus are discloses for wirebonding leads of a plurality of lead frames being part of a lead frame assembly by a wirebonding tool to semiconductor products mounted on the respective lead frames. The semiconductor products are clamped by a clamping mechanism comprising a stationary clamp and a movable clamp. The movable clamp follows the indexing movement of the lead frame assembly during wirebonding of the semiconductor products clamped by the movable clamp. The wirebonding process does not need to be interrupted for the indexing.
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申请公布号 |
US8474680(B2) |
申请公布日期 |
2013.07.02 |
申请号 |
US20090506065 |
申请日期 |
2009.07.20 |
申请人 |
KAMPSCHREUR THOMAS M.;STOKKERMANS JOEP;BAKKER ARJAN F.;VAN RENS PIET C. J.;DE VET ARNOLDUS J. C. B.;MEER PIET VAN DER;INVENSAS CORPORATION |
发明人 |
KAMPSCHREUR THOMAS M.;STOKKERMANS JOEP;BAKKER ARJAN F.;VAN RENS PIET C. J.;DE VET ARNOLDUS J. C. B.;MEER PIET VAN DER |
分类号 |
B23K31/00;H01L21/00 |
主分类号 |
B23K31/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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