Photosensitive resin composition

摘要

There is provided a photosensitive resin composition comprising: (a) 100 parts by weight of a polyorganosiloxane obtained by a method of combining at least one silanol compound represented by the following formula (1): R12Si(OH)2(1) {the groups in the formula being defined in the claims}, at least one alkoxysilane compound represented by the following formula (2): R2aR3bSi(OR4)4-a-b(2) {the groups in the formula being defined in the claims} and a catalyst, and polymerizing them without active addition of water; (b) 1-50 parts by weight of a photopolymerization initiator; (c) 40-600 parts by weight of a fluorene compound represented by the following formula (3): {the groups in the formula being defined in the claims}; and (d) 20-300 parts by weight of a compound other than component (c), having one or two (meth)acryloyl groups in the molecule.