摘要 |
A multi-band antenna mounted on a circuit board includes a ground plate perpendicularly connected to one side edge of the circuit board, a radiating plate perpendicularly connected to the other side edge of the circuit board, and a planar antenna element includes a high frequency radiating portion, a lower frequency radiating portion, a base plate, a capacitance portion and an inductance portion. The high frequency radiating portion and the lower frequency radiating portion are located at two ends of the circuit board, respectively, and both connected to the radiating plate. The base plate is connected to the radiating plate and located between the high and lower frequency radiating portions. The capacitance portion is parallel with the ground plate to form a capacitive coupling therebetween. The inductance portion is soldered to the ground plate. A simulation inductance is formed by the inductance portion.
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