| 摘要 |
PURPOSE: A modified polyphenylene oxide composition for integrated circuit test socket is provided to enhance electrical characteristic, molding processability, and profitability, thereby being used for manufacturing integrated circuit(IC) test socket. CONSTITUTION: A modified polyphenylene oxide composition for integrated circuit test socket comprises a modified polyphenylene oxide which is obtained by adding polystyrene or a polymerization derivative thereof to the polyphenylene oxide, carbon nanotubes, and acrylonitrile butadiene styrene based resin. The composition additionally includes 0.1-5 weight% of polycarbonate based on the total weight of the composition. The modified polyphenylene oxide is obtained by adding 20-60 parts by weight of polystyrene or a polymerization derivative thereof to the 100.0 parts by weight of polyphenylene oxide. |
