发明名称 PACKAGE
摘要 PURPOSE: A package is provided to maintain a chip area small and to efficiently repair a defective cell. CONSTITUTION: A first chip (100) includes a plurality of cell blocks. A second chip (200) includes a redundancy control unit (310) and a selection signal generation unit (330). The redundancy control unit activates a redundancy cell block corresponding to a repaired cell block in the more than one redundancy cell blocks when a cell block corresponding to an inputted address of the more than one redundancy cell blocks and the plurality of cell blocks. The selection signal generation unit generates a plurality of selection signals by decoding the inputted address and activates one selection signal in the plurality of selection signals. [Reference numerals] (110) First reception unit; (120) First selection signal control unit; (130_1,130_2,130_M,230_1,230_2,230_M) Cell block; (210) Second reception unit; (220) Second selection signal control unit; (311_1) First judge unit; (311_2) Second judge unit; (312) Transmission unit; (320_1) First redundancy unit; (320_2) Second redundancy unit; (330) Selection signal generation unit
申请公布号 KR20130071987(A) 申请公布日期 2013.07.01
申请号 KR20110139512 申请日期 2011.12.21
申请人 SK HYNIX INC. 发明人 OH, SANG MOOK;YUN, TAE SIK
分类号 G11C29/00 主分类号 G11C29/00
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