INDUCTIVELY COUPLED PLASMA PROCESSING SYSTEM

摘要

PURPOSE: An inductive coupling plasma processing system is provided to reduce capacitive coupling between an antenna and a chamber. CONSTITUTION: An inductive coupling plasma processing system (100) includes a process chamber (110), a stage (130), a polarity plate, and a power supply (200). The process chamber generates inductive coupling plasma. The stage is equipped in the inner lower side of process chamber and performs a plasma process. The polarity plate is equipped on the stage. The power supply generates an electric potential difference between the stage and the plate. The power supply includes an antenna, a balun transformer (180), and an impedance matching unit (190), and a power supply unit (196). The antenna is provided on the process chamber and includes a first antenna and a second antenna, which are separated from each other. The balun transformer is connected to both ends of antenna. The impedance matching unit is connected to the balun transformer. The power supply unit is connected to the impedance matching unit. The balun transformer includes a first coil, a first iron core, a second coil, and a second iron core. The first coil connects both ends of the first antenna. The first coil is wound round the first iron core. The second coil connects both ends of the second antenna, respectively. The second coil is wound round the second iron core.