发明名称 |
CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE AND METHOD FOR PRODUCING CONNECTION STRUCTURE |
摘要 |
PURPOSE: A circuit connection material and a connection body, and a manufacturing method of the connection body are provided to prevent the damage of electrode on a flexible substrate if the circuit material with a flexible substrate' is connected by the circuit connection material containing conductive particles. CONSTITUTION: A circuit connection material includes an insulating adhesive and conductive particles (5). The circuit connection material electrically connects a first circuit member (10) and a second circuit member. The first substrate of the first circuit member or/and the second substrate of the second circuit member is/are a flexible substrate containing a thermoplastic resin. The conductive particles include a plastic particle and a metal layer coating the plastic particle. The compressive hardness value of the conductive particles becomes 0.20 to 3.2 GPa according to the compressive displacement as much as 20% of the diameter of conductive particles. |
申请公布号 |
KR20130072156(A) |
申请公布日期 |
2013.07.01 |
申请号 |
KR20120149105 |
申请日期 |
2012.12.20 |
申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
SHINOHARA KENGO;KOGUCHI MISAO;GOTOU YASUSHI;FUJINAWA TOHRU;MATSUDA KAZUYA;TATSUZAWA TAKASHI |
分类号 |
H01R12/51;H01R4/04;H05K1/11;H05K3/36 |
主分类号 |
H01R12/51 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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