LIGHT EMITTING DEVICE AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A light emitting device and a manufacturing method of the light emitting device are provided to interpose the anisotropic conductive material on an upper side of a conductive layer and are provided to mount a flip chip on a light emitting diode, thereby providing a thin and miniaturized light emitting device with high reliability. CONSTITUTION: A light emitting diode (1) is used as the light source of a light emitting device. A first conductive layer (2a) is connected to an electrode of one side of the light emitting diode and a wire (3). A second conductive layer (2b) is connected to an electrode on the other side of the light emitting diode and the wire. The first conductive layer and the second conductive layer have a protrusion in each side, respectively. A light-transmitting insulating member (4) seals the first conductive layer and the second conductive layer hermetically.