COOLING THERMOELECTRIC MOUDULE AND METHOD OF MANUFACTURING METHOD OF THE SAME

摘要

PURPOSE: A thermoelectric module for cooling and a manufacturing method thereof are provided to maximize heat dissipation efficiency by implementing a cooling module using a thermoelectric element composed of thermoelectric materials with high cooling efficiency at high temperature. CONSTITUTION: A unit thermoelectric module includes a P-type semiconductor device (104a) and an N-type semiconductor device (104b) electrically connected to each other by electrodes (102a-102e). The P-type semiconductor device and the N-type semiconductor device are made of a mixture in which Bi or Te is mixed in a BiTe based main source material. A first substrate (101a) and a second substrate (101b) are faced to each other. A diffusion barrier film (103a-103h) prevents the diffusion of metal by being formed between the P-type and the N-type semiconductor. A heat dissipation plate is combined with the upper surface of the first substrate or the second substrate.