| 摘要 |
PURPOSE: A circuit board is provided to enhance heat dissipation efficiency by arranging multiple radiating units and broadening a radiating area. CONSTITUTION: A circuit pattern (120) is formed in the upper side and lower side of the base substrate (110). An adhesive layer (130) is formed in order to surround a surface of the circuit pattern and base substrate. A substrate section (160) is formed in the top and bottom of the adhesive layer. A radiating unit (150) is formed through the circuit pattern. A plating layer (140) is formed between the circuit pattern and the radiating unit.
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