THE METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD

摘要

PURPOSE: A manufacturing method of a printed circuit board is provided to reduce the heat and noise from edge by forming the winding circuit pattern without edge. CONSTITUTION: A first circuit pattern (120) is formed on an insulating substrate (110). A circuit pattern groove (131) is formed on the surface of the insulating substrate. A first metal layer (140) is plated on the surface of the above insulating substrate. A plating layer reclaiming the circuit pattern groove is formed. Fine buried pattern is formed by removing the plating layer through chemical mechanical polishing.