发明名称 NON-UV TYPE DICING DIE BONDING FILM
摘要 <p>PURPOSE: A non-UV type dicing die bonding film is provided to show an excellent pick-up characteristic, and to be able to maintain the adhesiveness to a ring frame without separation from the ring frame and the water leaching. CONSTITUTION: A non-UV type dicing die-bonding film comprises acrylic copolymer and a thermosetting material. The acrylic copolymer comprises (a) 55-99 parts by weight of alkyl acrylate monomer; (b) 5-30 parts by weight of acrylate monomer having hydroxyl group; and (c) 1-15 parts by weight of polyethyleneglycol (meth)acrylate to 100.0 parts by weight of the acrylic copolymer. The total content of the acrylate monomer having hydroxyl group and polyethyleneglycol (meth)acrylate to 100.0 parts by weight of the acrylic copolymer is 20-40 parts by weight.</p>
申请公布号 KR20130070964(A) 申请公布日期 2013.06.28
申请号 KR20110138245 申请日期 2011.12.20
申请人 CHEIL INDUSTRIES INC. 发明人 SEO, KWANG WON;CHO, KYOUNG RAE;CHOI, JAE WON
分类号 C09J7/02;C08F20/10;C09J133/04;H01L21/58 主分类号 C09J7/02
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