发明名称 Printed circuit board for use in e.g. lighting device of car, has pair of openings formed in metal layer to retain solder mass locally delimiting conducting pad to form localized conducting pad, which is extended between edges of openings
摘要 <p>The board has a dielectric substrate (36) covered by a metal layer (38) primarily comprising copper. A conducting zone of a free surface of the metal layer forms a rectangular conducting pad (40) to receive a solder mass (54). A pair of openings (44) are formed in the metal layer to retain the solder mass locally delimiting the conducting pad to form a localized conducting pad, which narrows the solder mass and is extended between two retaining edges (44B) of the openings. A connection pin (52) of an LED (32) is soldered on the conducting pad. An independent claim is also included for a method for manufacturing a printed circuit board.</p>
申请公布号 FR2985155(A1) 申请公布日期 2013.06.28
申请号 FR20110062242 申请日期 2011.12.22
申请人 VALEO VISION 发明人 ROGER CHRISTOPHE;DUARTE MARC;TOUZET BENJAMIN;YVON SYLVAIN;KRICK SEBASTIAN;ALVES JEAN-PHILIPPE;LAUVERNIER DENIS
分类号 H05K3/30;B60Q1/00;H05K1/18 主分类号 H05K3/30
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