发明名称 MANUFACTURING A FLEXIBLE STRUCTURE BY TRANSFERS OF LAYERS
摘要 PURPOSE: The manufacture of a flexible structure by transfer of layers is provided to prevent a damage of a flexible board by reducing temperature for fracture thermal budget. CONSTITUTION: A flexible structure (13) comprises a first thin film (3), a flexible board (9), and a second thin film (4). The above first thin film is less than 5μm thick. The above flexible board has stiffness same as- or smaller than-1×E7GPa.μm3 The above second thin film is less than 5μm thick. The above flexible structure has the radius of curvature wider than 1m. A stack including the flexible structure is formed by fixing the first thin film and the second thin film on a first side and a second side of the above flexible board, respectively. Fracture thermal budget is applied in order to transfer the above first thin film and the second thin film to the flexible board.
申请公布号 KR20130071381(A) 申请公布日期 2013.06.28
申请号 KR20120148302 申请日期 2012.12.18
申请人 COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIESALTERNATIVES 发明人 MORICEAU HUBERT;ARGOUD MAXIME;FOURNEL FRANK;MAZEN FREDERIC;MORALES CHRISTOPHE
分类号 H01L21/20;H01L21/02;H01L21/265 主分类号 H01L21/20
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