TAPE WIRING SUBSTRATE AND CHIP ON FILM PACKAGE INCLUDING THE SAME

摘要

PURPOSE: A tape wiring substrate and a chip on film package including the same are provided to reduce the stress applied to a line pattern by using at least one recess formed in the bending part of a base film. CONSTITUTION: A tape line board(130) includes a base film(110) and a line pattern(120). At least one recess(115) is formed on one surface of the base film. A chip mounting area for a semiconductor chip(140) is formed in the other surface of the base film. A line pattern is formed in the other surface of the base film and extended to the edge of the chip mounting area. A protection layer(160) covers the line pattern.