| 摘要 |
PURPOSE: A chemical-mechanical abrasion slurry composition is provided to remarkably reduce abrasion rate of an interlayer insulating film, thereby conduct a planarization of an insulating film with a stepped region. CONSTITUTION: A chemical-mechanical abrasion slurry composition comprises an abrasive particle, a pH modifier, a pH buffer agent, water, and an ionic liquid represented by chemical formula 1. In chemical formula 1, each of R1 and R2 is C1-10 alkyl group; X^- is a monovalent anion. The abrasive particle is selected from colloidal silica, fumed silica, alumina, ceria, titania, zirconia, and a mixture thereof. The pH modifier is selected from phosphoric acid, hydrochloric acid, sulfuric acid, nitric acid, ammonia, potassium hydroxide, tetramethyl ammonium hydroxide, tetraethyl ammonium hydroxide, and a mixture thereof.
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