发明名称 Selective Bias Compensation for Patterning Steps in CMOS Processes
摘要 A method includes forming a photo resist pattern, and performing a light-exposure on a first portion of the photo resist pattern, wherein a second portion of the photo resist pattern is not exposed to light. A photo-acid reactive material is coated on the first portion and the second portion of the photo resist pattern. The photo-acid reactive material reacts with the photo resist pattern to form a film. Portions of the photo-acid reactive material that do not react with the photo resist pattern are then removed, and the film is left on the photo resist pattern.
申请公布号 US2013164938(A1) 申请公布日期 2013.06.27
申请号 US201113335618 申请日期 2011.12.22
申请人 SHIEH MING-FENG;CHANG CHING-YU;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 SHIEH MING-FENG;CHANG CHING-YU
分类号 H01L21/311;G03F7/20 主分类号 H01L21/311
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